多重挑战和趋势下，半导体行业开始探索新的发展路径。 半个多世纪以来，微电子技术遵循着“摩尔定律”快速发展。但近年来，随着芯片制程工艺的演进，“摩尔定律”迭代进度放缓，导致芯片的性能增长边际成本急剧上升。

当光刻机巨头ASML正式挥师先进封装，一个时代的风向彻底变了。 先进封装，正成为近日半导体市场的行业热词。一边是光刻机龙头ASML正式把枪口对准先进封装，一边是博通开始出货 3.5D XDSiP 先进封装平台首款 SoC 芯片。

Samsung has announced the availability of its HybridSubstrate Cube dubbed the H-Cube earlier today, November 11. This is the South Korean tech company's latest 2.5D semiconductor packaging option.

SEOUL, Korea--(BUSINESS WIRE)--Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it has developed Hybrid-Substrate Cube (H-Cube) technology, its latest ...

IT之家 4 月 20 日消息，三星晶圆代工设计解决方案合作伙伴 GAONCHIPS 上周宣布其完成了 1ASIC + 4HBM 异构集成的技术验证，为首款 2.5D 先进封装产品的今年夏季量产打下了基础。IT之家了解到，GAONCHIPS ...

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it has developed Hybrid-Substrate Cube (H-Cube) technology, its ...