Then, in January 2024, the dormant fab was booted up again. Intel funneled billions into the facility, including $500 million ...

Taiwanese chip designer MediaTek said it has appointed former ‌TSMC executive Douglas Yu as a part-time ‌adviser as it steps ...

China's leading foundry, SMIC, is quietly recalibrating its strategy, moving beyond its long-standing focus on front-end ...

As we enter the AI era, the demand for enhanced connectivity in cloud services and AI computing continues to surge. With Moore’s Law slowing down, the increasing data rate requirements are surpassing ...

Delta Electronics, a global leader in power management and smart green solutions, attends SEMICON Southeast Asia 2026 to ...

TSMC introduced "Wafer Manufacturing 2.0" in July 2024, integrating packaging, testing, and photomask production into its portfolio. This move underscores a seismic shift in the advanced packaging ...

Manz Asia will be demonstrating its advanced inkjet metallization using Smartkem's (SMTK) advanced dielectric materials at SEMICON® SEA 2025 in Singapore, May 20-22, 2025. Visit Manz Asia at Booth no.

A new inter-die gapfill tool is purpose-built to solve critical challenges in 3D stacking and high-density heterogeneous integration. VECTOR TEOS 3D provides ultra-thick, uniform inter-die gapfill by ...

Patent-pending innovations deliver scalable materials building blocks for advanced AI and high-performance computing packaging solutions Wolfspeed, Inc. (NYSE: WOLF), a global leader in silicon ...

These recent customer wins represent a meaningful step forward in ACM’s continued expansion of its advanced packaging platform and global customer base, reflecting growing industry recognition of ...

Semiconductor manufacturing equipment maker KLA Corporation (NASDAQ:KLAC) reported Q1 CY2026 results , with sales up 11.5% ...

MINNEAPOLIS--(BUSINESS WIRE)--CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will unveil the new ...