The advanced packaging architecture designed for AI and high-performance computing (HPC) applications involves positioning memory in close proximity to AI processors, such as GPUs and AI ASICs, on a ...

On May 29, 2025, Marvell Technology, Inc. (NASDAQ:MRVL) launched the latest addition to its IP portfolio of custom AI compute platforms, a multi-die packaging platform. This production-qualified ...

Artificial intelligence (AI) is transforming industries, enhancing our daily lives, and improving efficiency and decision-making, but its need for compute processing power is growing at an astonishing ...

TOKYO--(BUSINESS WIRE)--Shin-Etsu Chemical Co., Ltd. (TOKYO: 4063) (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, “Shin-Etsu Chemical”) has developed equipment to manufacture ...